CEDRIC, J. C.; OKUJAGU, C. U.; OSAROLUBE, E. Thermal Conductivity of Different Grain Sizes of Top Bond, Clay and Starch Bonded NIPA Palm Wood Composite Products. The International Journal of Science & Technoledge, [S. l.], v. 5, n. 6, 2017. Disponível em: http://internationaljournalcorner.com/index.php/theijst/article/view/123562. Acesso em: 7 jul. 2024.