An Embedded System for Recording Vibration during Transportation of Launch Vehicle Sub-Assemblies

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Harikrishnan M.
Athira V. R.

Abstract

Abstract:
One of the major problems faced during the transportation of any sophisticated instruments comes in the form of vibrations. It is always necessary to keep a check on the physical impacts caused onto the machine during transport, measuring the extent of this phenomenon hence is of importance. An integrated system based on PIC microcontroller and digital accelerometer to find out the characteristics of road vibrations during the transportation of launch vehicle subassemblies can do the above. The system can also transfer the sensed data sampled at 1kHz from the sensor to the external memory space with time stamp so that it can be viewed and analysed later on a computer. Using of PIC as the brain here will results in advantages like low cost,less power requirement and low size of the system.

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